产品代码
MFR-2010-801
Availability
Published
Product Item Code
INT-29P16B1BLDNF2
Device Manufacturer
Intel
Device Type
内存
Subscription
内存- Embedded & Emerging
Channel
内存- Embedded & Emerging Floorplan Analysis
Report Code
MFR-2010-801
This report presents a Memory Floorplan Analysis of the Intel S15C die found inside the Intel 29P16B1BLDNF2 package. The 29P16B1BLDNF2 was extracted from the Intel MEMPEK1W016GAXT Optane 16 GB PCIe M.2 memory module.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Plan-view SEM micrograph of the die delayered to the WL and BL layers
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in CircuitVision
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
A unique vault of trusted, accurate data at your fingertips
Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.