对Google Pixel 6 Pro中5G广播的检查
作者：Radu Trandafir
At the beginning of September we were pondering the rumors about a Samsung 5G modem that was predicted to show up on the US shores in the form of the 5G implementation solution for the yet to be released Google Pixel 6.
Now that we have had the chance to inspect several of the Pixel 6 Pro phones we can positively state that it is real: Google has introduced a Pixel phone to rule them all (Pixel phones, that is). The Google Pixel 6 includes:
- 一个全新的创新型Google Tensor Soc（由Google设计和架构，并从三星提供了各种贡献，真相：Google Pixel 6的Linux内核的设备树文件系统分析TechInsights已执行的，这表明了一些障碍Google GS101张量处理器与Exynos共享）
- A full 5G radio solution developed by Samsung (from modem to antenna); this would be a first for the US market, where a major 5G phone without a Qualcomm modem was not available until now!
- 很多相机等等
Google Pixel 6 Pro Teardown Analysis
Download the teardown analysis brief below with anGoogle Tensor应用程序处理器的独家高分辨率bpoly Die Photo.
Now that Oppo is looking into developing their own SoC solutions for higher-end phones – expected sometime in 2023/2024 according toNikkei- 高通公司在智能手机市场中的主导地位似乎正在减少。
The inner workings of the 5G radio inside the Google Pixel 6 Pro, non-US version
Figure 1. The Samsung 5G modem, labelled here as Shannon A5123 (#3).
Figure 2. The FR1 (sub-6 GHz) transceiver package (#4) can be seen to the right of the modem, labelled as Samsung Shannon 5511.
图3.在Pixel 6 Pro手机的非US版本中缺少FR2（MM-WAVE）收发器软件包的足迹。
The FR2/mmWave specific components from a Google Pixel 6 Pro, US model
Figure 4. The Samsung 5G FR2 (mm-wave) IF transceiver, labelled here as Shannon 5710.
图5. Pixel 6 Pro（US模型） - Murata制造的双MM波天线模块。除了其双模块性质外，在iPhone 12和iPhone 13中看到的Murata/LSI AIP模块在外部非常相似（虽然使用QC Dies！）
Figure 6. Shows the location of the antenna modules relative to the housing of the Google Pixel 6 Pro.
图7.显示了位于Google Pixel 6 Pro中的天线模块。这三个互连部分很容易看到。
Comments and observations:
High level functional blocks appear to be similar to the Qualcomm solution: a single modem package feeding two branches (FR1 and FR2) with their corresponding transceiver solutions (see Diagram 1).
包装中的天线（AIP）由一个双天线封装组成，该包装在一个PCB上的FR2收发器组成，如果收发器（Shannon 5710）在FFC（FLFC（Flat Flex Caild）连接）上连接到FR2，并连接到FR2。
Expect all silicon to be Samsung, possibly with similar functionality to what we have seen in the Qualcomm designs. When we analyzed the Qualcomm AiP QTM525 and QTM535 we noted that there were more FR2 FE transceivers than needed for the antenna arrays in the AiP. This means it’s possible to have cascaded antenna arrays like in the Pixel 6 Pro implementation, where the active components and one antenna array are located on one module connected to a second one, a passive antenna array module.
图1:High-level block diagram of the 5G radio in the Google Pixel 6 Pro (US model)
(*) Expect this module to include mm-wave transceivers with PA and LNA as well as control circuits for beam steering and PMIC, capable of driving two dual-polarized antenna arrays like the QC SMR525.
